Electronics and Communication Engineering - Electronic Devices and Circuits
- Electronic Devices and Circuits - Section 1
- Electronic Devices and Circuits - Section 2
- Electronic Devices and Circuits - Section 3
- Electronic Devices and Circuits - Section 4
- Electronic Devices and Circuits - Section 5
- Electronic Devices and Circuits - Section 6
- Electronic Devices and Circuits - Section 7
- Electronic Devices and Circuits - Section 8
- Electronic Devices and Circuits - Section 9
- Electronic Devices and Circuits - Section 10
- Electronic Devices and Circuits - Section 11
- Electronic Devices and Circuits - Section 12
- Electronic Devices and Circuits - Section 13
- Electronic Devices and Circuits - Section 14
- Electronic Devices and Circuits - Section 15
- Electronic Devices and Circuits - Section 16
This is called field emission.
Therefore, conductivity increases.
Assertion (A): In a BJT, the base region is very thick.
Reason (R): In p-n-p transistor most of holes given off by emitter diffuse through the base.
Base region is thin.
Assertion (A): The behaviour of FET is similar to that of a pentode.
Reason (R): FETs and vacuum triode are voltage controlled devices.
Low work function permits easy emission.
- applying anode voltage at a sufficient fast rate
- applying sufficiently large anode voltage
- increasing the temperature of SCR to a sufficiently
- applying sufficiently large gate current.
If we apply the anode voltage above breakover voltage of SCR, SCR can be triggered. Also by sufficiently fast rate of rise of anode voltage and large gate current will trigger SCRon.
During forward blocking most of the applied voltage appears across reverse biased junction J2.
This voltage across J2 associated with leakage current may rise temperature of this junction.
With increase in temperature, leakage current through junction J2 further increases and this cumulative process may turn on the SCR at some high temperature.