Current Affairs - Economy - Discussion

Madhya Pradesh signed a Memorandum of Understanding (MoU) with Paras Semiconductors on July 22, 2026, to establish a ₹6,200 crore greenfield Outsourced Semiconductor Assembly and Test (OSAT) facility in the Indore-Ujjain region. The project will focus on advanced integrated circuit (IC) packaging technologies, including 2.5D and 3D packaging, chiplet integration, wafer bumping, and heterogeneous integration. The agreement was signed with the Madhya Pradesh State Electronics Development Corporation (MPSeDC), reinforcing the state's ambition to become a major semiconductor and electronics manufacturing hub. The initiative is also expected to attract further investments, generate employment, and strengthen India's semiconductor ecosystem.